? e97408-te sony reserves the right to change products and specifications without prior notice. this information does not convey any license by any implication or otherwise under any patents or other right. application circuits shown, if any, are typical examples illustrating the operation of the devices. sony cannot assume responsibility for any problems arising out of the use of these circuits. absolute maximum ratings (ta=25 ?) supply voltage v dd 6v operating temperature topr ?5 to +85 ? storage temperature tstg ?5 to +150 ? power dissipation p d 150 mw current consumption i dd (low noise amplifier) 20 ma i dd (lo amplifier) 10 ma i dd (mixer, if amplifier) 20 ma input power p in +5 dbm operating condition supply voltage 3.0 v description the CXG1014N is a low noise amplifier/down conversion mixer mmic, designed using the sony? gaas j-fet process. features low noise nf=1.85 db (typ.) at 1.49 ghz (low noise amplifier) low distortion input ip3=+2 dbm (typ.) at 1.49 ghz (mixer) low lo input power operation ?5 dbm single 3.0 v power supply operation 16-pin ssop package applications 1.5 ghz japan digital cellular telephones structure gaas j-fet mmic 1.5 ghz low noise amplifier/down conversion mixer 16 pin ssop (plastic) CXG1014N
? CXG1014N electrical characteristics v dd =3.0 v, f rf =1.49 ghz, f lo =1.62 ghz, p lo =?5 dbm, when 50 i/o matching; unless otherwise specified (ta=25 ?) item current consumption power gain low noise noise figure amplifier input ip3 isolation current consumption conversion gain mixer noise figure input ip3 lo to rf leak level symbol i dd g p nf iip3 i so i dd g c nf iip3 p lk min. 14 ?.5 30 6 ? typ. 2.2 16 1.85 ?.5 35 3.8 8 8.5 2 ?7 max. 3.0 18 2.6 5.5 10 10.5 ?2 unit ma db db dbm db ma db db dbm dbm block diagram pin configuration lna mix lo amp if amp lna rf in lo in lna rf out mix rf in if out 16pin ssop (plastic) 116 lna rf in nc cap gnd gnd lo in cap v dd (lo amp) gnd gnd nc nc mix rf in cap if out/v dd (mix, if amp) lna rf out /v dd (lna) measurement condition when no signal when no signal
? CXG1014N recommended circuit c1 l2 c12 l1 l7 c4 l8 c15 l9 c8 1 lna rf in lo in v dd (lo amp) l3 c2 l5 c6 c7 r1 l4 l10 c10 c5 16 lna rf out v dd (lna) mix rf in if out v dd (mix, if amp) l6 c14 c13 c9 c11 c3 c16 l1 l2 l3 l4 l5 l6 l7 l8 l9 6.8 nh 4.7 nh 4.7 nh 3.3 nh 10 nh 4.7 nh 5.6 nh 3.3 nh 10 nh l10 c1 c2 c3 c4 c5 c6 c7 c8 150 nh 100 pf 100 pf 2 pf 100 pf 10 pf 1000 pf 1 ? 1000 pf c9 c10 c11 c12 c13 c14 c15 c16 r1 10 nf 1000 pf 1 ? 100 pf 1000 pf 1 ? 1000 pf 1 ? 1 k
? CXG1014N c13 c12 c14 c16 c15 gnd v dd (mix, if amp) v dd (lo amp) v dd (lna) glass fabric-base epoxy 4-layer board (2 0.3 mm thickness) gnd for the 2nd and 3rd layers. recommended evaluation board front back 50mm l2 c7 l4 l1 c1 r1 l3 c2 l8 l7 c4 l9 c8 c9 c10 c11 l10 c5 l5 c3 l6 gnd lna rf in lo in lna rf out mix rf in if out v dd (lna) v dd (lo amp) v dd (mix, if amp) s s o o n n y y c c x x g g 1 1 0 0 1 1 4 4 n n c6
? CXG1014N example of representative characteristics (ta=25 ?) p out im3 0 20 ?0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 0 v dd =3.0v f rf1 =1.49ghz f rf2 =1.4901ghz 0 20 ?0 ?0 ?0 ?0 ?5 ?5 ?5 ? 5 p out im3 v dd =3.0v f rf1 =1.49ghz f rf2 =1.4901ghz f lo =1.62ghz p lo =?5dbm 10 8 6 4 2 0 v dd =3.0v f rf =1.49ghz f lo =1.62ghz 0 ?5 ?0 ?5 ?0 ? 5 15 13 11 9 7 5 g c nf 4 2 0 ? ? ? 0 ?5 ?0 ?5 ?0 ? 5 ? ?0 ?5 ?0 ?5 ?0 v dd =3.0v f rf =1.49ghz f lo =1.62ghz iip3 p lk lna block p out , im3 vs. p in p in -rf input power (dbm) p out -rf output power (dbm) mix block p out , im3 vs. p in p in -rf input power (dbm) p out -if output power (dbm) mix block g c , nf vs. p lo p lo -lo input power (dbm) g c -conversion gain (db) nf-noise figure (db) iip3-input ip3 (dbm) p lk -lo to rf leak level (dbm) mix block iip3, p lk vs. p lo p lo -lo input power (dbm)
16pin ssop (plastic) sony code eiaj code jedec code package structure package material lead treatment lead material package weight epoxy resin solder / palladium copper / 42 alloy 0.1g ssop-16p-l01 ssop016-p-0044 * 5.0 0.1 0.65 0.12 0.22 ?0.05 + 0.1 8 1 9 16 * 4.4 0.1 6.4 0.2 0.1 0.1 0.5 0.2 0?to 10 0.15 ?0.02 + 0.05 1.25 ?0.1 + 0.2 a detail a 0.1 plating note: dimension * ?does not include mold protrusion. package outline unit : mm CXG1014N ? note : palladium plating this product uses s-pdppf (sony spec.-palladium pre-plated lead frame).
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